TSMC to Launch European Chip Design Centre in Munich by Q3 2025

TSMC to Launch European Chip Design Centre in Munich by Q3 2025

TSMC to Open European Chip Design Centre in Munich, Germany

Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest contract chipmaker, has announced plans to launch a new chip design center in Munich by the third quarter of 2025, reinforcing its commitment to expand operations in Europe’s semiconductor sector.

The announcement was made by Paul de Bot, President of TSMC Europe, during the company’s 2025 Technology Symposium.

Munich Design Centre to Support High-Performance Chip Development

The upcoming TSMC Munich Design Center will focus on:

  • High-density chip design
  • High-performance and energy-efficient chips
  • Applications in automotive, industrial, AI, and IoT markets

“It’s intended to support European customers in designing high-density, high-performance, and energy-efficient chips,” said de Bot.

This marks a strategic step in TSMC’s efforts to localize chip design support for European clients, especially in the rapidly growing automotive and AI sectors.

TSMC Collaborates on ESMC Chip Plant in Dresden

In addition to the Munich center, TSMC is working with Infineon Technologies, NXP Semiconductors, and Robert Bosch GmbH to build the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany.

The ESMC fab aims to strengthen Europe’s chip manufacturing capacity, aligning with the EU Chips Act to boost local semiconductor resilience and reduce dependency on non-European suppliers.

TSMC’s Growing Footprint in Europe

The Munich design center and Dresden manufacturing plant together signal TSMC’s long-term investment in Europe’s semiconductor ecosystem. With growing demand for advanced chips in connected cars, AI systems, and smart factories, the region is becoming a key growth market for global chipmakers.

Key Takeaways

  • TSMC will open a European chip design center in Munich in Q3 2025.
  • The facility will focus on chip solutions for automotive, AI, industrial, and IoT applications.
  • TSMC is also co-developing a chip manufacturing facility in Dresden with Infineon, NXP, and Bosch.
  • The move strengthens Europe’s semiconductor ecosystem and aligns with the EU’s goals for tech sovereignty.

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